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Tuesday, May 12, 2020 | History

3 edition of Manufacturing aspects in electronic packaging found in the catalog.

Manufacturing aspects in electronic packaging

Manufacturing aspects in electronic packaging

presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992

  • 334 Want to read
  • 7 Currently reading

Published by The Society in New York .
Written in English

    Subjects:
  • Electronic packaging -- Congresses.,
  • Manufacturing processes -- Congresses.

  • Edition Notes

    Includes bibliographical references and index.

    Statementsponsored by the Electrical and Electronic Packaging Division and the Production Engineering Division, ASME ; edited by Y.C. Lee, T.J. Bennett.
    SeriesEEP ;, vol. 2, PED ;, vol. 60, EEP (Series) ;, vol. 2., PED (Series) ;, vol. 60.
    ContributionsLee, Yung-Cheng., Bennett, T. J., American Society of Mechanical Engineers. Electrical and Electronic Packaging Division., American Society of Mechanical Engineers. Production Engineering Division., American Society of Mechanical Engineers. Winter Meeting
    Classifications
    LC ClassificationsTK7870.15 .M34 1992
    The Physical Object
    Paginationv, 211 p. :
    Number of Pages211
    ID Numbers
    Open LibraryOL1745956M
    ISBN 100791811123
    LC Control Number92056567

    Moreover, many devices used in the healthcare sector depends on semiconductor manufacturing technology, which, in turn, is expected to impact the electronic packaging market. Furthermore, the global wi-fi chipset market is experiencing the transition to 5th Wi-Fi generation, the ac with MIMO. This book focuses on the latest development of devices and fabrication processes in the field of extremely miniaturized electromechanical systems. The book offers new knowledge and insight into design, fabrication, and packaging, as well as solutions in these aspects for targeted applications, aiming to support scientists, engineers and.

      This document outlines the information to be included on labels, unless its absence can be justified, for example, use of a centralised electronic randomisation system. Complete details on primary and secondary packaging and labelling requirements can be found in Annex 13 of the PIC/S Guide to Good Manufacturing Practice for Medicinal Products. The presence of the Packaging Research Center, Manufacturing Research Center, and Microelectronics Research Center have stimulated significant research interest among graduate students in various aspects of electronic packaging.

    This book is ideal for professionals in semiconductor fabrication, packaging of electronic and optoelectronic devices and solar cells and medical device packaging areas as well as graduate students studying materials science and engineering or electronic packaging materials and processing. Electronics comprises the physics, engineering, technology and applications that deal with the emission, flow and control of electrons in vacuum and matter. This distinguishes it from classical electrical engineering as it uses active devices to control electron flow by amplification and rectification rather than just using passive effects such as resistance, capacitance and inductance.


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Purchase Manufacturing Flexible Packaging - 1st Edition. Print Book & E-Book. ISBNJournal of Applied Mechanics, Journal of Biomechanical Engineering, Journal of Computing and Information Science in Engineering, Journal of Dynamic Systems, Measurement and Control, Journal of Electronic Packaging, Journal of Energy Resources Technology, Journal of Engineering for Gas Turbines and Power, Journal of Engineering Materials and Technology, Journal of Fluids Engineering, Journal.

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